Heat Sink Compounds

Heat Sink Compounds

Heat sink pastes and heat sink grease draw heat away when applied to a component. In electronics, this heat sink compound is generally used to thermally bond a component with a mechanical heat sink. For electrical applications, it is used with thermocouple wells, thermistors, and calrods, or wherever efficient cooling is required.

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Silicone-Free Heat Sink Compound

Thermal compound for electronics, avoid silicone contamination- Ideal for electronic applications where silicone contamination hurts solderability and increases solder defects