Desoldering Braid 吸锡编带

Desoldering Braid 吸锡编带

Desoldering braid (wick) is pre-fluxed copper braid that is used to remove solder, which allows components to be replaced and excess solder to be removed.

Techspray wick is available in static dissipative bobbins (except where indicated) for static sensitive environments.

Techspray No-Clean desolder braid's wick is coated with proprietary flux that only leaves a slight clear residue, which does not cause service issues. Cleaning after using Techspray No-Clean wick is strictly optional.

Specifications: Meets or Exceeds MIL-F-14256; NASA NHB 5300, 4 (34-1); NASA NPC 200-4; NASA SP5002; 1821:HP 8690-0588; 1823: HP 8690-0577; IPC Standard-J-STD-004


吸锡编带是用于吸除焊料的富含专有的助焊剂的铜编织物,有效去除多余焊料以及便于元器件的更换。

Techspray品牌的吸锡编带具有静电耗散线轴(除了指定的地方)更适用于在静电敏感的环境中的应用。

Techspray 免洗型吸锡编带中含有专有的助焊剂, 使用后残留物极地,不造成任何维修问题。在使用Techspray 免洗型吸锡编带后, 线路板可使用Techspary旗下清洗剂进行的清洁。

规格:符合或超出MIL-F-14256; NASA NHB 5300,434-1; 美国宇航局NPC 200-4; NASA SP5002; 1821HP 8690-0588; 1823HP 8690-0577; IPC标准-J-STD-004

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No-Clean Desoldering Braid 免洗型吸锡编带

No-clean flux coated braid, cleanest in the industry! 富含专有助焊剂的吸锡编带在行业内的吸锡效果最佳!

Pro Wick Desoldering Braid松香型吸锡编带

Rosin coated braid for fast wicking action 富含松香的吸锡编带能快速获得吸锡效果

Unfluxed Desoldering Braid 无助焊剂型吸锡编带

Use your own flux, ideal for aqueous process 客户可自选助焊剂,选用水基型助焊剂最佳